Development of conductive pastes and inks, surface treatment, synthesis, and evaluation of metal nanoparticles.
- Low-temperature and room-temperature sintering of Ag-based materials - Cu-based antioxidant - Surface oxidation control - Dispersion stabilization - Conductivity improvement - Optimal adjustment methods according to various printing techniques
This book focuses on "conductive pastes, particularly copper and silver," and is an unparalleled resource that covers surface treatment, manufacturing, synthesis, evaluation as firing thin films, application development, and future markets specifically for paste materials specialized in copper (Cu) and silver (Ag). It highlights challenges with a particular emphasis on ink and paste technology, covering key points comprehensively. Additionally, it includes significant applications such as printed electronics and touch panel wiring materials, particularly focusing on antioxidant properties in copper paste and low-temperature sintering and low resistance in silver paste. This book encompasses specific surface treatment methods that are not found in other similar publications. It can be considered a cutting-edge technical book written by leading researchers in this field. I hope it serves as a guide for readers considering the development of conductive pastes and inks to create new products.
